The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Jul. 07, 2015
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Taekjung Kim, Seoul, KR;

Myung-Ho Kong, Hwaseong-si, KR;

Heesook Park, Hwaseong-si, KR;

Youngwook Park, Osan-si, KR;

Mansug Kang, Suwon-si, KR;

Seonghwee Cheong, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/532 (2006.01); H01L 27/108 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 23/528 (2006.01); H01L 27/22 (2006.01); H01L 49/02 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53266 (2013.01); H01L 23/528 (2013.01); H01L 23/53271 (2013.01); H01L 27/10817 (2013.01); H01L 27/10876 (2013.01); H01L 27/10885 (2013.01); H01L 27/10894 (2013.01); H01L 27/10897 (2013.01); H01L 27/228 (2013.01); H01L 28/91 (2013.01); H01L 29/0642 (2013.01); H01L 29/42372 (2013.01); H01L 29/66666 (2013.01); H01L 29/7827 (2013.01); H01L 29/41766 (2013.01); H01L 29/42356 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor memory device can include a first conductive line crossing over a field isolation region and crossing over an active region of the device, where the first conductive line can include a first conductive pattern being doped, a second conductive pattern, and a metal-silicon-nitride pattern between the first and second conductive patterns and can be configured to provide a contact at a lower boundary of the metal-silicon-nitride pattern with the first conductive pattern and configured to provide a diffusion barrier at an upper boundary of the metal-silicon-nitride pattern with the second conductive pattern.


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