The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Aug. 21, 2015
International Business Machines Corporation, Armonk, NY (US);
Marcus E. Interrante, New Paltz, NY (US);
Yi Pan, The Woodlands, TX (US);
Hilton T. Toy, Hopewell Junction, NY (US);
Jeffrey A. Zitz, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Methods and apparatuses for reducing directional stress in an orthotropic encapsulation member of an electronic package may include attaching a stiffening frame to a carrier, the stiffening frame comprising a central opening to accept a semiconductor chip and a plurality of opposing sidewalls, electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening, and thermally contacting a directional heat spreader to the semiconductor chip, the directional heat spreader transferring heat from the semiconductor chip, wherein the directional heat spreader is shaped to reduce a directional stress along the opposing bivector direction.