The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Oct. 09, 2012
Applicant:

Fujimi Incorporated, Kiyosu-shi, Aichi, JP;

Inventors:

Kohsuke Tsuchiya, Kiyosu, JP;

Yoshio Mori, Kiyosu, JP;

Shinichiro Takami, Kiyosu, JP;

Shuhei Takahashi, Kiyosu, JP;

Assignee:

FUJIMI INCORPORATED, Kiyosu-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/04 (2012.01); H01L 21/304 (2006.01); C09K 3/14 (2006.01); H01L 21/02 (2006.01); C09G 1/02 (2006.01);
U.S. Cl.
CPC ...
B24B 37/044 (2013.01); C09G 1/02 (2013.01); C09K 3/1463 (2013.01); H01L 21/02024 (2013.01); H01L 21/304 (2013.01);
Abstract

Provided is a polishing composition, which comprises abrasive grains, a water-soluble polymer, an aggregation inhibitor and water. The ratio R1/R2 is 1.3 or less, where R1 represents the average particle diameter of the particles present in the polishing composition and R2 represents the average particle diameter of the abrasive grains when the abrasive grains are dispersed in water at the same concentration as that of the abrasive grains in the polishing composition. The polishing composition can be used mainly for polishing the surface of a silicon substrate.


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