The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Feb. 28, 2014
Mitsubishi Materials Corporation, Tokyo, JP;
Tomoya Oohiraki, Kitamoto, JP;
Sotaro Oi, Kitamoto, JP;
Kimihito Nishikawa, Kitamoto, JP;
Hiromasa Hayashi, Tokyo, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
A method of manufacturing power-module substrates, after bonding copper-circuit platesat intervals on a ceramic platehaving an area in which ceramic substrates can be formed abreast, by dividing the ceramic platebetween the copper-circuit plates, in which: bonding-material layersof active-metal brazing material having same shapes as outer shapes of the copper-circuit platesare formed on the ceramic plate; temporal-stick materialincluding polyethylene glycol as a major ingredient is spread on the copper-circuit plates, the bonding-material layersand the copper-circuit platesare temporarily fixed on the ceramic platein a state of laminating with positioning by the temporal-stick material; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded.