The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Jul. 19, 2010
Harun Erismis, Stuttgart, DE;
Michael Geiss, Stuttgart, DE;
Dominik Nemec, Stuttgart, DE;
Frank Jördens, Traunstein, DE;
Gerhard Schmidmayer, Bad Endorf, DE;
Philipp Schaller, Traunreut, DE;
Jürgen Salomon, Trostberg, DE;
Harun Erismis, Stuttgart, DE;
Michael Geiss, Stuttgart, DE;
Dominik Nemec, Stuttgart, DE;
Frank Jördens, Traunstein, DE;
Gerhard Schmidmayer, Bad Endorf, DE;
Philipp Schaller, Traunreut, DE;
Jürgen Salomon, Trostberg, DE;
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., Munich, DE;
BSH Hausgeräte GmbH, Munich, DE;
Abstract
The invention relates to a method for producing a heater, in particular a high-temperature heater and also a high-temperature heater, for example for domestic heating appliances, in which a layer that produces heat when a current flows through is provided on a carrier material () as a heating element (), wherein a first electrically conductive layer () which is formed from a free-flowing, non-electrically conductive base material and carbon nano tubes dispersed therein is applied to the carrier material (), wherein a protective layer () is applied to this first layer () and at least partly penetrates into the first layer () as it is applied, or wherein a functional layer () with carbon nano tubes dispersed therein is applied to the carrier material (), and wherein the at least one layer () or the functional layer () makes contact with strip-like contact elements (), and the layers () applied to the carrier material or the functional layer () are heated.