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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9576904 B1

PDFFull Text
Date of Patent:
Feb. 21, 2017

Filed:

Aug. 17, 2015

Semiconductor devices comprising interconnect structures and methods of fabrication

Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Gurtej S. Sandhu, Boise, ID (US);

Nishant Sinha, Boise, ID (US);

John A. Smythe, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:

TraskBritt

Primary Examiner:

Michele Fan

Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 27/105 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/76805 (2013.01); H01L 21/76816 (2013.01); H01L 21/76877 (2013.01); H01L 21/76879 (2013.01); H01L 23/5226 (2013.01); H01L 23/5329 (2013.01); H01L 23/53209 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 27/105 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Semiconductor devices comprise at least one integrated circuit layer, at least one conductive trace and an insulative material adjacent at least a portion of the at least one conductive trace. At least one interconnect structure extends through a portion of the at least one conductive trace and a portion of the insulative material, the at least one interconnect structure comprising a transverse cross-sectional dimension through the at least one conductive trace which differs from a transverse cross-sectional dimension through the insulative material.

Find Patent Forward Citations

Quick Actions:

Sandhu, Gurtej. (2017). Semiconductor devices comprising interconnect structures and methods of fabrication (U.S. Patent No. 9576904). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9576904

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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