The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Jun. 25, 2014
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Tetsuji Togawa, Tokyo, JP;

Kenya Ito, Tokyo, JP;

Yu Ishii, Tokyo, JP;

Keisuke Uchiyama, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 1/04 (2006.01); H01L 21/304 (2006.01); H01L 21/687 (2006.01); B08B 1/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B08B 1/04 (2013.01); B08B 1/006 (2013.01); H01L 21/304 (2013.01); H01L 21/67046 (2013.01); H01L 21/67051 (2013.01); H01L 21/687 (2013.01); H01L 21/68728 (2013.01);
Abstract

There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.


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