The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Aug. 27, 2014
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-ken, JP;

Inventors:

Noriyoshi Shimizu, Nagano, JP;

Wataru Kaneda, Nagano, JP;

Hiromu Arisaka, Nagano, JP;

Akio Rokugawa, Nagano, JP;

Assignee:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 1/00 (2006.01); H05K 1/18 (2006.01); H05K 7/10 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/421 (2013.01); H05K 1/115 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H05K 1/116 (2013.01); H05K 3/38 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0352 (2013.01); H05K 2201/096 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/2072 (2013.01); H05K 2203/0789 (2013.01);
Abstract

A wiring board includes a first insulating layer coating a first wiring layer. A first through hole is opened in a surface of the first insulating layer and exposes a surface of the first wiring layer. A first via arranged in the first through hole includes an end surface exposed to the surface of the first insulating layer. A gap is formed between the first insulating layer and the first via in the first through hole. A second wiring layer is stacked on the surface of the first insulating layer and the end surface of the first via. The second wiring layer includes a pad filling the gap. The pad is greater in planar shape than the first through hole.


Find Patent Forward Citations

Loading…