The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Nov. 25, 2013
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Dominic J. Benvegnu, La Honda, CA (US);

Boguslaw A. Swedek, Cupertino, CA (US);

David J. Lischka, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); B24B 37/013 (2012.01); B24B 49/12 (2006.01); B24D 7/12 (2006.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); B24B 37/013 (2013.01); B24B 49/12 (2013.01); B24D 7/12 (2013.01); H01L 21/31053 (2013.01); H01L 21/3212 (2013.01);
Abstract

A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.


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