The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Mar. 28, 2012
Applicants:

Jian Wang, Shanghai, CN;

Yinuo Jin, Shanghai, CN;

Yong Shao, Shanghai, CN;

Hui Wang, Shanghai, CN;

Inventors:

Jian Wang, Shanghai, CN;

Yinuo Jin, Shanghai, CN;

Yong Shao, Shanghai, CN;

Hui Wang, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23B 31/30 (2006.01); H01L 21/683 (2006.01); B25B 11/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); B23B 31/307 (2013.01); B25B 11/005 (2013.01); H01L 2221/683 (2013.01); Y10T 279/11 (2015.01);
Abstract

A vacuum chuck is disclosed for holding and positioning wafers more stably and securely. The vacuum chuck includes a supporting assembly having a receiving groove and at least one first vacuum aperture defined in the receiving groove. A seal unit includes a seal ring bulging to form a vacuum trough. The seal ring is fixed in the receiving groove of the supporting assembly and has at least one second vacuum aperture communicating with the first vacuum aperture. A chuck connector fastened with the supporting assembly has at least one vacuum port and at least one vacuum orifice communicating with the vacuum port. At least one vacuum hose connects the first vacuum aperture, the second vacuum aperture with the vacuum orifice and the vacuum port of the chuck connector for evacuating the air of the vacuum trough to hold and position the wafer on the seal ring and the supporting assembly.


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