The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Jun. 25, 2015
Applicant:

Cabot Microelectronics Corporation, Aurora, IL (US);

Inventors:

Lin Fu, Naperville, IL (US);

Steven Grumbine, Aurora, IL (US);

Jeffrey Dysard, St. Charles, IL (US);

Wei Weng, Naperville, IL (US);

Lei Liu, Naperville, IL (US);

Alexei Leonov, Aurora, IL (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/306 (2006.01); H01L 21/3105 (2006.01); C09K 3/14 (2006.01); H01L 21/321 (2006.01); C09K 13/00 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C09K 3/14 (2013.01); H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); H01L 21/31055 (2013.01); H01L 21/3212 (2013.01); C09K 3/1463 (2013.01); C09K 13/00 (2013.01);
Abstract

A chemical-mechanical polishing composition includes colloidal silica abrasive particles having a chemical compound incorporated therein. The chemical compound may include a nitrogen-containing compound such as an aminosilane or a phosphorus-containing compound. Methods for employing such compositions include applying the composition to a semiconductor substrate to remove at least a portion of at least one of a copper, a copper barrier, and a dielectric layer.


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