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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9552987 B1

PDFFull Text
Date of Patent:
Jan. 24, 2017

Filed:

Jun. 06, 2014

Substrate processing method, substrate processing apparatus, and storage medium

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yuichiro Miyata, Koshi, JP;

Keiichi Tanaka, Nirasaki, JP;

Kenichi Ueda, Koshi, JP;

Takahiro Shiozawa, Koshi, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorneys:

Nath, Goldberg & Meyer

Jerald L. Meyer

Primary Examiner:

Stephanie Duclair

Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/302 (2006.01); H01L 21/461 (2006.01); B44C 1/22 (2006.01); H01L 21/027 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); G03F 7/42 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0273 (2013.01); G03F 7/422 (2013.01); H01L 21/02065 (2013.01); H01L 21/31133 (2013.01); H01L 21/6715 (2013.01); H01L 21/67115 (2013.01); H01L 21/7684 (2013.01); H01L 2224/11916 (2013.01);
Abstract

A substrate processing method is performed to improve surface roughness of a pattern mask formed on a substrate by being exposed and developed. The method includes supplying a first solvent in a gaseous state to a surface of the substrate to dissolve the pattern mask, and supplying a second solvent to the surface of the substrate, which is supplied with the first solvent, to dissolve the pattern mask, wherein a permeability of the second solvent is lower than a permeability of the first solvent.

Find Patent Forward Citations

Miyata, Yuichiro. (2017). Substrate processing method, substrate processing apparatus, and storage medium (U.S. Patent No. 9552987). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9552987

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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