The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Mar. 25, 2011
Keita Kato, Haibara-gun, JP;
Shinji Tarutani, Haibara-gun, JP;
Toru Tsuchihashi, Haibara-gun, JP;
Sou Kamimura, Haibara-gun, JP;
Yuichiro Enomoto, Haibara-gun, JP;
Kana Fujii, Haibara-gun, JP;
Kaoru Iwato, Haibara-gun, JP;
Shohei Kataoka, Haibara-gun, JP;
Kazuyoshi Mizutani, Haibara-gun, JP;
Keita Kato, Haibara-gun, JP;
Shinji Tarutani, Haibara-gun, JP;
Toru Tsuchihashi, Haibara-gun, JP;
Sou Kamimura, Haibara-gun, JP;
Yuichiro Enomoto, Haibara-gun, JP;
Kana Fujii, Haibara-gun, JP;
Kaoru Iwato, Haibara-gun, JP;
Shohei Kataoka, Haibara-gun, JP;
Kazuyoshi Mizutani, Haibara-gun, JP;
FUJIFILM Corporation, Tokyo, JP;
Abstract
Provided is a method of forming a pattern, ensuring excellent exposure latitude (EL) and focus latitude (depth of focus DOF). The method of forming a pattern includes (A) forming a film from a resist composition, the resist composition, (B) exposing the film to light, and (C) developing the exposed film using a developer containing an organic solvent, thereby forming a negative pattern. The resist composition contains (a) a resin that is configured to decompose when acted on by an acid and ΔSP thereof represented by formula (1) below is 2.5 (MPa)or above, (b) a compound that is composed to generate an acid when exposed to actinic rays or radiation, and (c) a solvent.ΔSP=SP−SP  (1)