The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2017
Filed:
Apr. 02, 2014
Applicant:
Freescale Semiconductor, Inc., Austin, TX (US);
Inventors:
Vijay Sarihan, Paradise Valley, AZ (US);
Zhiwei Gong, Chandler, AZ (US);
Scott M. Hayes, Chandler, AZ (US);
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/03 (2013.01); H05K 1/111 (2013.01); H05K 1/114 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05017 (2013.01); H01L 2224/05025 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/20641 (2013.01);
Abstract
A solder ball pad for mounting a solder ball of a semiconductor device for preventing delamination of an overlying dielectric layer, and particularly devices and methods providing improved solder ball pad structures in a device such as a semiconductor device package.