The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

Aug. 10, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Shou-Shu Lu, Kaohsiung, TW;

Hsun-Ying Huang, Tainan, TW;

Hsin-Jung Huang, Kaohsiung, TW;

Chun-Mao Chiu, Kaohsiung, TW;

Chia-Chi Hsiao, Tianzhong Township, TW;

Yung-Cheng Chang, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 31/028 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14687 (2013.01); H01L 27/1462 (2013.01); H01L 27/1464 (2013.01); H01L 27/14618 (2013.01); H01L 27/14632 (2013.01); H01L 27/14636 (2013.01); H01L 27/14683 (2013.01); H01L 27/14685 (2013.01); H01L 31/028 (2013.01); H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method of fabricating a semiconductor image sensor device is disclosed. A plurality of radiation-sensing regions is formed in a substrate. The radiation-sensing regions are formed in a non-scribe-line region of the image sensor device. An opening is formed in a scribe-line region of the image sensor device by etching the substrate in the scribe-line region. A portion of the substrate remains in the scribe-line region after the etching. The opening is then filled with an organic material.


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