The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2017
Filed:
Dec. 17, 2013
Applicant:
United Microelectronics Corp., Hsin-Chu, TW;
Inventors:
Hsin-Ting Tsai, Hsinchu, TW;
Cheng-Hung Yu, Taoyuan County, TW;
Chin-Kuang Liu, Hsinchu, TW;
Ming-Hsin Lee, Taoyuan County, TW;
Wei-Hong Chuang, Taoyuan County, TW;
Kuei-Chang Tung, Miaoli County, TW;
Yan-Yi Lu, Taoyuan County, TW;
Chin-Chin Wang, Yun-Lin County, TW;
Assignee:
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/04 (2006.01); H01L 21/67 (2006.01); B08B 3/02 (2006.01);
U.S. Cl.
CPC ...
B08B 3/04 (2013.01); B08B 3/02 (2013.01); H01L 21/6708 (2013.01); H01L 21/67051 (2013.01);
Abstract
A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.