The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Sep. 11, 2014
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Mukta G. Farooq, Hopewell Junction, NY (US);

Timothy D. Sullivan, Underhill, VT (US);

Ping-Chuan Wang, Hopewell Junction, NY (US);

Lijuan Zhang, Fremont, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 23/525 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5256 (2013.01); H01L 23/481 (2013.01); H01L 23/585 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An method including forming a back end of the line (BEOL) wiring portion directly on top of a semiconductor base portion, the BEOL wiring portion including a plurality of layers of a metallic material and a dielectric material and excluding a semiconductor material, forming a through-substrate via through the BEOL wiring portion and the semiconductor base portion, forming an electronic fuse in the BEOL wiring portion adjacent to the through-substrate via, and forming a guard ring in the BEOL wiring portion surrounding the through-substrate via and the electronic fuse in the BEOL wiring portion, the through-substrate via in the semiconductor base portion being free from the guard ring.


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