The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Mar. 13, 2014
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Yeh Hsu, Guishan Township, TW;

Chia-Wen Liu, Taipei, TW;

Tsung-Hsing Yu, Taipei, TW;

Ken-Ichi Goto, Hsin-Chu, TW;

Shih-Syuan Huang, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/306 (2006.01); H01L 21/28 (2006.01); H01L 29/66 (2006.01); H01L 29/10 (2006.01); H01L 21/3065 (2006.01); H01L 29/165 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30604 (2013.01); H01L 21/28123 (2013.01); H01L 21/3065 (2013.01); H01L 29/1037 (2013.01); H01L 29/1054 (2013.01); H01L 29/66651 (2013.01); H01L 29/165 (2013.01);
Abstract

Some embodiments of the present disclosure relate to a semiconductor device configured to mitigate against parasitic coupling while maintaining threshold voltage control for comparatively narrow transistors. In some embodiments, a semiconductor device formed on a semiconductor substrate. The semiconductor device comprises a channel comprising an epitaxial layer that forms an outgrowth above the surface of the semiconductor substrate, and a gate material formed over the epitaxial layer. In some embodiments, a method of forming a semiconductor device is disclosed. The method comprises etching the surface of a semiconductor substrate to form a recess between first and second isolation structures, forming an epitaxial layer within the recess that forms an outgrowth above the surface of the semiconductor substrate, and forming a gate material over the epitaxial layer. Other embodiments are also disclosed.


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