The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Jan. 21, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

David A. Grosch, Burlington, VT (US);

Gregory V. Miller, South Burlington, VT (US);

Brian C. Noble, Lagrangeville, NY (US);

Ann L. Swift, Richmond, VT (US);

Joel Thomas, Granby, CA;

Jody J. Van Horn, Underhill, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); G01R 31/28 (2006.01); G01R 31/26 (2014.01);
U.S. Cl.
CPC ...
G01R 31/2875 (2013.01); G01R 31/2601 (2013.01); G01R 31/2858 (2013.01); G01R 31/2863 (2013.01);
Abstract

A method, apparatus and computer program product for testing semiconductor products that combines multiple techniques. Depending on the requirements, different ones of the techniques are emphasized over the other techniques. The testing applies a technique to achieve a higher single defect acceleration parameter at the expense of a second parameter, thus enabling acceleration of defects that require higher voltage or higher temperature than a traditional 'Burn In' can achieve, which defects would otherwise go unaccelerated. The method manages the adaptation of the different techniques, e.g., how it decides to favor one technique over the other, and how it carries out the favoring of one or more particular techniques in a given test situation. Thus, acceleration to defectivity (defect type and quantity) may be tailored in real time by uniquely leveraging the duration spent in a given section of a process flow based on the prevalence of unique defect types.


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