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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9529258 B1

PDFFull Text
Date of Patent:
Dec. 27, 2016

Filed:

Dec. 25, 2013

Energy-sensitive resin composition

Applicant:

Tokyo Ohka Kogyo Co., Ltd., Kawasaki-shi, JP;

Inventors:

Kunihiro Noda, Kawasaki, JP;

Hiroki Chisaka, Kawasaki, JP;

Dai Shiota, Kawasaki, JP;

Kazuya Someya, Kawasaki, JP;

Assignee:

TOKYO OHKA KOGYO CO., LTD., Kawasaki-Shi, JP;

Attorney:

Knobbe Martens Olson & Bear LLP

Primary Examiner:

Amanda C Walke

Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01); C07D 233/60 (2006.01); C07C 323/47 (2006.01); C07D 209/86 (2006.01); C08K 5/33 (2006.01); G03F 7/038 (2006.01); C09D 179/08 (2006.01); C08G 73/10 (2006.01); C07D 233/56 (2006.01); C08K 5/34 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0041 (2013.01); C07C 323/47 (2013.01); C07D 209/86 (2013.01); C07D 233/60 (2013.01); C08G 73/105 (2013.01); C08G 73/1042 (2013.01); C08G 73/1067 (2013.01); C08G 73/1071 (2013.01); C08G 73/1078 (2013.01); C08K 5/33 (2013.01); C09D 179/08 (2013.01); G03F 7/0045 (2013.01); G03F 7/0387 (2013.01); G03F 7/16 (2013.01); G03F 7/20 (2013.01); G03F 7/32 (2013.01); G03F 7/40 (2013.01); C07D 233/56 (2013.01); C08K 5/34 (2013.01);
Abstract

The present invention provides an energy-sensitive resin composition, a method of manufacturing a polyimide film or a polyimide molded product in which said composition is used, and a method of forming a pattern in which said composition is used. The composition supplies a polyimide resin exhibiting exceptional thermal resistance and low permittivity even by a heat treatment at a low temperature. The composition contains polyamic acid obtained by reacting tetracarboxylic dianhydride and diamine, a solvent, and a compound (A) decomposing by the action of light and/or heat and generating a base and/or an acid. The method of manufacturing a polyimide film or a polyimide molded product includes forming a coating film or molded product comprising the composition and decomposing the compound (A) in the film or product through exposure or heating. The method of forming a pattern sequentially includes forming, selectively exposing, developing and heating the film or product.

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