The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2016
Filed:
May. 15, 2015
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Shyh-Wei Cheng, Hsinchu County, TW;
Chao-Po Lu, Hsinchu County, TW;
Chung-Hsien Hun, Hsinchu County, TW;
Chih-Shan Chen, New Taipei, TW;
Chuan-Yi Ko, Hsinchu County, TW;
Chih-Yu Wang, Taichung, TW;
Hsi-Cheng Hsu, Taichung, TW;
Ji-Hong Chiang, Changhua County, TW;
Jui-Chun Weng, Taipei, TW;
Wei-Ding Wu, Hsinchu County, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
The present disclosure relates to a microelectromechanical systems (MEMS) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the MEMS package comprises a device substrate and a CMOS substrate. The device substrate comprises a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate. A surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon. A method for manufacturing the MEMS package is also provided.