The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2016
Filed:
Jan. 21, 2015
Applicant:
Ebara Corporation, Tokyo, JP;
Inventors:
Tsuneo Torikoshi, Tokyo, JP;
Hirofumi Otaki, Tokyo, JP;
Assignee:
Ebara Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/67 (2006.01); B24B 49/00 (2012.01); B24B 37/04 (2012.01); H01L 21/306 (2006.01); B24B 49/16 (2006.01); B24B 37/013 (2012.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); B24B 37/042 (2013.01); B24B 49/00 (2013.01); H01L 21/67219 (2013.01); H01L 21/67253 (2013.01); B24B 37/013 (2013.01); B24B 49/16 (2013.01); H01L 21/30625 (2013.01);
Abstract
A polishing method and a polishing apparatus for performing a measurement of a film thickness of a substrate, such as a wafer, if an error has occurred during polishing of the substrate. The polishing method includes polishing a plurality of substrates, measuring a film thickness of at least one substrate, which has been designated in advance, of the plurality of substrates that have been polished, and if a polishing error has occurred during polishing of any one of the plurality of substrates, measuring a film thickness of that substrate.