The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2016

Filed:

Mar. 19, 2012
Applicants:

Jeffrey E. Krampert, Topsfield, MA (US);

Richard J. Hertel, Boxford, MA (US);

John Robert Fairhurst, Plaistow, NH (US);

Inventors:

Jeffrey E. Krampert, Topsfield, MA (US);

Richard J. Hertel, Boxford, MA (US);

John Robert Fairhurst, Plaistow, NH (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/20 (2006.01); H01J 37/317 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01); C23C 14/22 (2006.01); C23C 14/50 (2006.01); C23C 14/54 (2006.01);
U.S. Cl.
CPC ...
H01J 37/20 (2013.01); C23C 14/221 (2013.01); C23C 14/50 (2013.01); C23C 14/541 (2013.01); H01J 37/3171 (2013.01); H01L 21/67109 (2013.01); H01L 21/68728 (2013.01); H01L 21/68792 (2013.01); H01J 2237/2001 (2013.01); Y10T 29/49998 (2015.01);
Abstract

A system and method are disclosed for holding and cooling substrates during processing. A substrate clamp has an engagement portion for engaging a substrate about the inside diameter as well as a portion of the substrate surface immediately adjacent to the inside diameter. The clamp has a retracted position which enables the engagement portion to fit through the substrate ID, and an expanded position which enables the engagement portion to engage the substrate ID and the substrate surface immediately adjacent to the inside diameter. The clamp can include a conformal coating to enhance engagement between the substrate and the engagement portion. The clamp can also include an energy absorbing coating on one or more surfaces to maximize the absorption of radiative energy emitted from the substrate. Other embodiments are described and claimed.


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