The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2016
Filed:
Jun. 29, 2012
Applicants:
Mladenko Vukic, Portland, OR (US);
Kalyan C. Kolluru, Portland, OR (US);
Inventors:
Mladenko Vukic, Portland, OR (US);
Kalyan C. Kolluru, Portland, OR (US);
Assignee:
INTEL CORPORATION, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H01L 21/66 (2006.01); G01R 31/312 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2853 (2013.01); G01R 31/2894 (2013.01); G01R 31/312 (2013.01); H01L 22/14 (2013.01); H01L 23/481 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01);
Abstract
In accordance with one aspect of the present description, an integrated circuit die has a plurality of through-body-vias and a testing circuit on board the die which allows charges on a first and second through-body-via to redistribute between them to provide an indication whether one or both of the first and second through-body-vias has a defect. Other aspects are described.