The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Jan. 22, 2014
Applicant:

Central Glass Company, Limited, Ube-shi, Yamaguchi, JP;

Inventors:

Katsuhiro Akiyama, Saitama, JP;

Yu Matsuno, Fujimino, JP;

Hiroshi Eguchi, Saitama, JP;

Kazuhiro Yamanaka, Tachikawa, JP;

Junya Nakatsuji, Fujimino, JP;

Wataru Kawai, Fujimino, JP;

Tsuyoshi Ogawa, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/12 (2006.01); C08G 77/08 (2006.01); C09K 3/10 (2006.01); H01L 23/29 (2006.01); C09D 183/14 (2006.01); C08L 83/06 (2006.01); C08L 83/04 (2006.01); H01L 33/56 (2010.01); C08G 77/16 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
C08G 77/12 (2013.01); C08G 77/08 (2013.01); C08L 83/04 (2013.01); C08L 83/06 (2013.01); C09D 183/14 (2013.01); C09K 3/1018 (2013.01); H01L 23/296 (2013.01); C08G 77/16 (2013.01); C08G 77/20 (2013.01); H01L 33/56 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Disclosed is a curable composition including a silicone (A) of a specific structure and a composition containing Si—OH group and Si—H group, a silicone (B) of a specific structure and a composition containing Si—OH group and Si—CH═CHgroup, and a hydrosilylation catalyst of a catalytic quantity containing at least one metal compound selected from the group consisting of platinum compounds, palladium compounds, and rhodium compounds. In this curable composition, as kind of each silicone and the content of Si—OH group are adjusted, in curing the silicone, foaming in a cured product can be inhibited by inhibiting a dehydration condensation reaction between Si—OH groups, as compared with a hydrosilylation reaction which is a reaction of Si—CH═CHgroup and Si—H group. Furthermore, an excellent adhesion to a base body such as semiconductor substrate can be given when making a cured film.


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