The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2016
Filed:
Oct. 18, 2012
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/06 (2006.01); H01L 21/44 (2006.01); B23K 1/20 (2006.01); H01L 23/00 (2006.01); B22D 17/20 (2006.01); B23K 3/08 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 1/20 (2013.01); B22D 17/2023 (2013.01); B23K 3/0623 (2013.01); B23K 3/0638 (2013.01); B23K 3/085 (2013.01); H01L 24/11 (2013.01); H01L 24/741 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/11312 (2013.01); H01L 2224/11848 (2013.01); H01L 2224/742 (2013.01); H05K 3/3468 (2013.01);
Abstract
Provided is a solder bump forming method that enables micro-solder bumps to be formed without the possibility of occurrence of a bridge due to excess molten solder. An injection headfor supplying molten solder has a nozzlebrought into contact with a mask with openings that is disposed over a substrate. After completing a supply operation, the injection headis forcedly cooled by heat transfer from a cooling unitthrough a heater unitwhose operation has been stopped. Molten solderin the cooled injection headdoes not drool from the nozzlewhen the injection headmoves up.