The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Aug. 20, 2014
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Chih-Hsien Chiu, Taichung, TW;
Hsin-Lung Chung, Taichung, TW;
Cho-Hsin Chang, Taichung, TW;
Chia-Yang Chen, Taichung, TW;
Chao-Ya Yang, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.