The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Aug. 12, 2013
Applicant:
Fujimi Incorporated, Kiyosu-shi, Aichi, JP;
Inventors:
Kohsuke Tsuchiya, Kiyosu, JP;
Shuhei Takahashi, Kiyosu, JP;
Assignee:
FUJIMI INCORPORATED, Kiyosu-Shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 16/06 (2006.01); C08F 26/10 (2006.01); C09G 1/02 (2006.01); B24B 37/04 (2012.01); H01L 21/02 (2006.01); C09K 3/14 (2006.01); C09G 1/16 (2006.01); C08B 11/08 (2006.01); C08G 81/00 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/044 (2013.01); C08B 11/08 (2013.01); C08F 16/06 (2013.01); C08F 26/10 (2013.01); C08G 81/00 (2013.01); C09G 1/16 (2013.01); C09K 3/1436 (2013.01); C09K 3/1463 (2013.01); H01L 21/02024 (2013.01); Y02P 20/582 (2015.11);
Abstract
A polishing composition includes a water-soluble polymer having a weight average molecular weight of 1000000 or less and a molecular weight distribution represented by weight average molecular weight (Mw)/number average molecular weight (Mn) that is less than 5.0. The polishing composition is mainly used in an application for polishing a substrate, preferably in an application for performing final polishing on a substrate.