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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9502377 B1

PDFFull Text
Date of Patent:
Nov. 22, 2016

Filed:

Aug. 20, 2013

Semiconductor package and fabrication method thereof

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Chih-Hsien Chiu, Taichung Hsien, TW;

Tsung-Hsien Tsai, Taichung Hsien, TW;

Chao-Ya Yang, Taichung Hsien, TW;

Chia-Yang Chen, Taichung Hsien, TW;

Chih-Ming Cheng, Taichung Hsien, TW;

Yude Chu, Taichung Hsien, TW;

Assignee:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Attorneys:

Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.

Peter F. Corless

Steven M. Jensen

Primary Examiner:

John C Ingham

Assistant Examiner:

Ismail Muse

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 23/433 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 23/4334 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 25/0657 (2013.01); H01L 23/3121 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/73 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06575 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19103 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module.

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