The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2016
Filed:
Jan. 15, 2016
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Hsueh-An Yang, Taipei, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A semiconductor device package includes a first substrate, which has a lower substrate surface and an upper substrate surface. A conductive dummy gate structure is disposed over the upper substrate surface. An interconnect structure is disposed over the conductive dummy gate structure. The interconnect structure includes a plurality of metal layers disposed within a dielectric structure and at least one of the metal layers is electrically coupled to the conductive dummy gate structure. A conductive through-substrate via extends from the lower substrate surface to an underside of the conductive dummy gate structure and is electrically coupled to the conductive dummy gate structure.