The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Jun. 26, 2014
Applicants:

Heejo Chi, Yeoju-gun, KR;

Bartholomew Liao Chung Foh, Singapore, SG;

Sheila Marie L. Alvarez, Singapore, SG;

Zigmund Ramirez Camacho, Singapore, SG;

Dao Nguyen Phu Cuong, Singapore, SG;

Inventors:

HeeJo Chi, Yeoju-gun, KR;

Bartholomew Liao Chung Foh, Singapore, SG;

Sheila Marie L. Alvarez, Singapore, SG;

Zigmund Ramirez Camacho, Singapore, SG;

Dao Nguyen Phu Cuong, Singapore, SG;

Assignee:

STATS ChipPAC Pte. Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); H01L 21/568 (2013.01); H01L 23/5383 (2013.01);
Abstract

An integrated circuit packaging system, and a method of manufacture thereof, includes: a support structure having: an internal insulation layer having a hole, a device connection side, and a removal mark characteristic of a conductive seed layer removed at the device connection side, a first conductive pad in the hole at the device connection side, and an exterior insulation layer over the first conductive pad at the device connection side; an integrated circuit over the exterior insulation layer; and an encapsulation over the integrated circuit.


Find Patent Forward Citations

Loading…