The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Jun. 28, 2013
Applicants:
Mitsubishi Materials Corporation, Tokyo, JP;
Mitsubishi Shindoh Co., Ltd., Tokyo, JP;
Inventors:
Assignees:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
MITSUBISHI SHINDOH CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); H01B 5/02 (2006.01); B32B 15/01 (2006.01); B21B 3/00 (2006.01); C22C 9/04 (2006.01); C22F 1/00 (2006.01); C22F 1/08 (2006.01);
U.S. Cl.
CPC ...
H01B 1/026 (2013.01); B21B 3/00 (2013.01); B32B 15/01 (2013.01); C22C 9/04 (2013.01); H01B 5/02 (2013.01); C22F 1/00 (2013.01); C22F 1/08 (2013.01); Y10T 428/12 (2015.01); Y10T 428/12715 (2015.01);
Abstract
A copper alloy for electric and electronic devices comprises 23 mass % to 36.5 mass % of Zn; 0.1 mass % to 0.9 mass % of Sn; 0.15 mass % to less than 1.0 mass % of Ni; 0.001 mass % to less than 0.10 mass % of Fe; 0.005 mass % to 0.1 mass % of P; and a balance including Cu and unavoidable impurities, in which 0.002≦Fe/Ni<0.7, 3<(Ni+Fe)/P<15, and 0.3<Sn/(Ni+Fe)<2.9, are satisfied by atomic ratio, and a fraction R{220} of the X-ray diffraction intensity from the {220} plane is 0.8 or less.