The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Oct. 30, 2014
Dowa Metaltech Co., Ltd., Tokyo, JP;
Weilin Gao, Tokyo, JP;
Akira Sugawara, Tokyo, JP;
Ryosuke Miyahara, Tokyo, JP;
Hisashi Suda, Tokyo, JP;
DOWA METALTECH CO., LTD., Tokyo, JP;
Abstract
Manufacturing method of a copper alloy sheet including melting and casting a raw material of a copper alloy having a composition containing 1.0 mass % to 3.5 mass % Ni, 0.5 mass % to 2.0 mass % Co, and 0.3 mass % to 1.5 mass % Si with a balance being composed of Cu and an unavoidable impurity. The method includes the steps of first cold rolling, intermediate annealing, second cold rolling, a solution heat treatment and aging. The solution heat treatment includes: heating at 800° C. to 1020° C.; first quenching to 500° C. to 800° C.; maintaining the 500° C. to 800° C. temperature for 10 seconds to 600 seconds; and second quenching to 300° C. or lower.