The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
Jun. 23, 2015
Applicant:
Lam Research Corporation, Fremont, CA (US);
Inventors:
Lie Zhao, Lake Oswego, OR (US);
Artur Kolics, Dublin, CA (US);
Assignee:
Lam Research Corporation, Fremont, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53238 (2013.01); H01L 21/02118 (2013.01); H01L 21/02164 (2013.01); H01L 21/76802 (2013.01); H01L 21/76843 (2013.01); H01L 21/76879 (2013.01); H01L 23/5226 (2013.01);
Abstract
A method of filling features in a dielectric layer is provided. A pure Co or pure Ru adhesion layer is deposited against surfaces of the features, wherein the adhesion layer is separated from some of the surfaces of the features of the low-k dielectric layer by no more than 10 Å. The features are filled with Cu or a Cu alloy.