The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
Jul. 17, 2012
Applicants:
Ken'etsu Yokogawa, Tsurugashima, JP;
Masatoshi Miyake, Kamakura, JP;
Takashi Uemura, Kudamatsu, JP;
Masaru Izawa, Hino, JP;
Satoshi Sakai, Yokohama, JP;
Inventors:
Ken'etsu Yokogawa, Tsurugashima, JP;
Masatoshi Miyake, Kamakura, JP;
Takashi Uemura, Kudamatsu, JP;
Masaru Izawa, Hino, JP;
Satoshi Sakai, Yokohama, JP;
Assignee:
HITACHI HIGH-TECHNOLOGIES CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 9/00 (2006.01); H01J 37/32 (2006.01); H01L 21/324 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32091 (2013.01); H01J 37/32522 (2013.01); H01L 21/324 (2013.01); H01L 21/67115 (2013.01);
Abstract
Provided is a heat treatment apparatus that is high in thermal efficiency and can reduce surface roughness of a substrate to be treated even when a specimen is heated at 1200° C. or higher. The heat treatment apparatus heating the specimen includes a heating plate heated by plasma formed in an area of a gap to heat the specimen.