The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

May. 22, 2014
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Hung Chen, Sunnyvale, CA (US);

Rajeev Bajaj, Fremont, CA (US);

Brian J. Brown, Palo Alto, CA (US);

Robert T. Lum, Palo Alto, CA (US);

Fred C. Redeker, Fremont, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); B24B 53/017 (2012.01); B24B 37/26 (2012.01); B26F 3/00 (2006.01); B23K 26/36 (2014.01); B26D 3/06 (2006.01);
U.S. Cl.
CPC ...
B24B 53/017 (2013.01); B23K 26/36 (2013.01); B24B 37/26 (2013.01); B26D 3/06 (2013.01); B26F 3/004 (2013.01);
Abstract

Among other things, a method comprises polishing a surface of a substrate by applying a pressure between the surface of a substrate and a surface of a polishing pad. The surface of the polishing pad defines one or more grooves separated by one or more partition regions. The one or more grooves have an initial depth before the polishing starts and extend from an initial outer surface of the one or more partition regions to an initial bottom of the one or more grooves. The method also comprises removing material below an initial bottom of the one or more grooves such that a distance between an outer surface of the one or more partition regions and a bottom of the one or more grooves remain substantially the same as the initial depth.


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