The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2016
Filed:
Mar. 15, 2013
Qualcomm Incorporated, San Diego, CA (US);
Chin-Kwan Kim, San Diego, CA (US);
Omar James Bchir, San Diego, CA (US);
Milind Pravin Shah, San Diego, CA (US);
Marcus Bernard Hsu, San Diego, CA (US);
David Fraser Rae, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
To achieve a package-on-package having an advantageously reduced height, a first package substrate has a window sized to receive a second package die. The first package substrate interconnects to the second package substrate through a plurality of package-to-package interconnects such that the first and second substrates are separated by a gap. The second package die has a thickness greater than the gap such that the second package die is at least partially disposed within the first package substrate's window.