The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2016
Filed:
Aug. 19, 2015
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Yutaka Yoneda, Tokyo, JP;
Hidetoshi Ishibashi, Tokyo, JP;
Masao Kikuchi, Tokyo, JP;
Tatsunori Yanagimoto, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/481 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 23/3735 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83205 (2013.01);
Abstract
A semiconductor device of the present invention includes a bonding target and an electrode terminal bonded to the bonding target. The electrode terminal and the bonding target are bonded by ultrasonic bonding at a bonding surface to be subjected to bonding. The electrode terminal includes a penetrating hollow part surrounded on at least two sides by the bonding surface.