The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2016
Filed:
Oct. 19, 2012
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49562 (2013.01); H01L 23/49524 (2013.01); H01L 23/49548 (2013.01); H01L 23/49568 (2013.01); H01L 24/36 (2013.01); H01L 24/40 (2013.01); H01L 23/3107 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40245 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/181 (2013.01);
Abstract
In accordance with an embodiment of the present invention, a semiconductor device includes a lead frame having a die paddle and a lead. A chip is disposed over the die paddle of the lead frame. The semiconductor device further includes a clip, which is disposed over the chip. The clip couples a pad on the chip to the lead of the lead frame. The clip also includes a heat sink.