The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2016
Filed:
Jun. 26, 2015
Infineon Technologies Ag, Neubiberg, DE;
Kok Yau Chua, Melaka, MY;
Sook Woon Chan, Melaka, MY;
Chau Fatt Chiang, Melaka, MY;
Stefan Martens, Munich, DE;
Matthias Steiert, Ehrenkirchen, DE;
Kian Hong Yeo, Melaka, MY;
Hock Siang Chua, Johor, MY;
Mei Chin Ng, Melaka, MY;
Swee Kah Lee, Melaka, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor package includes an electrically conductive lead-frame, including a first die paddle having a first opening, and a plurality of electrically conductive leads, a ridge formed around a perimeter of the first opening, and an electrically insulating molding compound. The electrically insulating molding compound includes an interior cavity being defined by a planar base surface and outer sidewalls, a second opening formed in the base surface, and an interior sidewall within the interior cavity. The molding compound is formed around the lead-frame with the first die paddle in the interior cavity. The first and second openings are aligned with one another so as to form a port that provides access to the interior cavity. The ridge and the interior sidewall form a dam that is configured to collect liquefied sealant and prevent the liquefied sealant from overflowing into the port or into adjacent regions of the interior cavity.