The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Dec. 12, 2013
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Frank Evans, Queen Creek, AZ (US);
Shipeng Qiu, Chandler, AZ (US);
Dhruv Bhate, Scottsdale, AZ (US);
Sergei Voronov, Chandler, AZ (US);
Tao Wang, Chengdu, CN;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); H01L 23/544 (2006.01); H01L 21/3105 (2006.01); B23K 26/06 (2014.01); H01L 21/67 (2006.01); B23K 26/36 (2014.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); B23K 26/0626 (2013.01); B23K 26/082 (2015.10); B23K 26/362 (2013.01); H01L 21/3105 (2013.01); H01L 21/67282 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54406 (2013.01); H01L 2223/54413 (2013.01); H01L 2223/54433 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Apparatus, systems, and methods are provided to generate markings on the surface of a die or substrate. The markings represent information. The markings can be annealed onto the surface of the die or substrate using a laser. Another embodiment can use an out-of-focus laser beam to mark a solder resist material.
Evans, Frank. (2016). Die or substrate marking using a laser (U.S. Patent No. 9472505). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9472505
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile