The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2016

Filed:

Feb. 23, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Hans-Peter Moll, Dresden, DE;

Peter Baars, Dresden, DE;

Thorsten Kammler, Dresden, DE;

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/49 (2006.01); H01L 27/092 (2006.01); H01L 23/535 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4958 (2013.01); H01L 21/823842 (2013.01); H01L 23/535 (2013.01); H01L 27/092 (2013.01);
Abstract

A semiconductor structure includes a substrate, at least one electrically conductive pillar provided over the substrate and an electrically conductive structure provided over the substrate. The electrically conductive pillar includes an inner portion and an outer layer that is provided below the inner portion and lateral to the inner portion. The electrically conductive structure also includes an inner portion and an outer layer that is provided below the inner portion and lateral to the inner portion. The electrically conductive structure annularly encloses each of the at least one electrically conductive pillar. The outer layer of each of the at least one electrically conductive pillar contacts the outer layer of the electrically conductive structure. The outer layer of the at least one electrically conductive pillar and the outer layer of the electrically conductive structure are formed of different metallic materials.


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