The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2016

Filed:

Aug. 24, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Akihiro Horibe, Kawasaki, JP;

Hiroyuki Mori, Kawasaki, JP;

Yasumitsu Orii, Kawasaki, JP;

Kuniaki Sueoka, Kawasaki, JP;

Kazushige Toriyama, Kawasaki, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 25/065 (2006.01); H01L 23/48 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 21/308 (2006.01); H01L 21/48 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/308 (2013.01); H01L 21/486 (2013.01); H01L 21/76802 (2013.01); H01L 21/76831 (2013.01); H01L 21/76843 (2013.01); H01L 21/76871 (2013.01); H01L 21/76879 (2013.01); H01L 23/481 (2013.01); H01L 23/5226 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/9202 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06544 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01);
Abstract

A semiconductor structure including a through electrode includes a lamination body including at least three layers, including respective vertically aligned electrode parts, the electrode part on the surface of an uppermost layer and including an aperture, the electrode part of the intermediate layer having an aperture smaller than the aperture of the uppermost layer; a through-hole extending from the aperture of the electrode part on the uppermost layer to the surface of the electrode part on a lowermost layer, the through-hole having a depressed part on a side wall thereof between the electrode parts therein; an insulating layer disposed on the entire side wall in the through-hole at a part other than on surfaces of the electrode parts; and a conductive material filling the through-hole from the surface of the electrode part on the lowermost layer to the surface of the electrode part on the uppermost layer.


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