The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2016

Filed:

Oct. 30, 2015
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Scott L. Light, Boise, ID (US);

Yuan He, Boise, ID (US);

Michael A. Many, Meridian, ID (US);

Michael Hyatt, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 7/20 (2006.01); G03F 7/039 (2006.01); G03F 7/075 (2006.01); G03F 7/095 (2006.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0035 (2013.01); G03F 7/039 (2013.01); G03F 7/0392 (2013.01); G03F 7/0758 (2013.01); G03F 7/095 (2013.01); G03F 7/2022 (2013.01); G03F 7/32 (2013.01); G03F 7/322 (2013.01); G03F 7/325 (2013.01); G03F 7/405 (2013.01);
Abstract

Methods of forming a pattern in a semiconductor device structure include deprotecting an outer portion of a first photosensitive resist material, forming a second photosensitive resist material, exposing portions of the first and second photosensitive resist materials to radiation, and removing the deprotected outer portion of the first photosensitive resist material and the exposed portions of the first and second photosensitive resist materials. Additional methods include forming a first resist material over a substrate to include a first portion and a relatively thicker second portion, deprotecting substantially the entire first portion and an outer portion of the second portion while leaving an inner portion of the second portion protected, and forming a second resist material over the substrate. A portion of the second resist material is exposed to radiation, and deprotected and exposed portions of the first and second resist materials are removed.


Find Patent Forward Citations

Loading…