The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2016

Filed:

Feb. 19, 2014
Applicant:

Rohm and Haas Electronic Materials Cmp Holdings, Inc., Newark, DE (US);

Inventors:

George McClain, Middletown, DE (US);

Alan Saikin, Landenberg, PA (US);

David Kolesar, Gulph Mills, PA (US);

Aaron Sarafinas, Ivyland, PA (US);

Robert L. Post, Ivyland, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 11/00 (2006.01); B24B 37/24 (2012.01); B24D 3/32 (2006.01); B24D 18/00 (2006.01); B24B 37/20 (2012.01); B24B 37/22 (2012.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); B24D 3/32 (2013.01); B24D 18/0009 (2013.01);
Abstract

A method of making a polishing layer for polishing a substrate selected from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate is provided, comprising: providing a liquid prepolymer material; providing a plurality of hollow microspheres; exposing the plurality of hollow microspheres to a carbon dioxide atmosphere for an exposure period to form a plurality of treated hollow microspheres; combining the liquid prepolymer material with the plurality of treated hollow microspheres to form a curable mixture; allowing the curable mixture to undergo a reaction to form a cured material, wherein the reaction is allowed to begin ≦24 hours after the formation of the plurality of treated hollow microspheres; and, deriving at least one polishing layer from the cured material; wherein the at least one polishing layer has a polishing surface adapted for polishing the substrate.


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