logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9460983 B1

PDFFull Text
Date of Patent:
Oct. 04, 2016

Filed:

Sep. 13, 2012

Joining structure using thermal interface material

Applicants:

Michio Horiuchi, Nagano, JP;

Yasue Tokutake, Nagano, JP;

Yuichi Matsuda, Nagano, JP;

Inventors:

Michio Horiuchi, Nagano, JP;

Yasue Tokutake, Nagano, JP;

Yuichi Matsuda, Nagano, JP;

Assignee:

Shinko Electric Industries Co., LTD., Nagano-ken, JP;

Attorney:

Wolf, Greenfield & Sacks, P.C.

Primary Examiner:

Leonard R Leo

Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 23/433 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 21/4882 (2013.01); H01L 21/50 (2013.01); H01L 23/433 (2013.01); H01L 23/3733 (2013.01); H01L 23/3735 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15311 (2013.01); H05K 7/2039 (2013.01); H05K 7/20509 (2013.01);
Abstract

A thermal interface material includes a metal foil, which has a first surface and an opposite second surface, and a plurality of rod conductors each having a side surface extending in a thickness direction of the metal foil. The rod conductors are arranged on at least one of the first and second surfaces of the metal foil in a planar direction that is perpendicular to the thickness direction. A resin layer covers at least the first surface and the second surface of the metal foil and the side surfaces of the rod conductors.

Find Patent Forward Citations

Horiuchi, Michio. (2016). Joining structure using thermal interface material (U.S. Patent No. 9460983). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9460983

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…