The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
Jul. 17, 2014
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Tae-Hoon Kim, Anyang-si, KR;
Hideto Kato, Annaka, JP;
Jae-Hyun Kim, Yongin-si, KR;
Jun-Won Han, Seoul, KR;
Hiroyuki Yasuda, Annaka, JP;
Shohei Tagami, Annaka, JP;
Michihiro Sugo, Annaka, JP;
Jung-Sik Choi, Seongnam-si, KR;
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 183/04 (2006.01); C09J 183/06 (2006.01); C08G 77/00 (2006.01); C08G 77/52 (2006.01); B32B 27/28 (2006.01); H01L 21/683 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); B05D 3/02 (2006.01);
U.S. Cl.
CPC ...
C09J 183/06 (2013.01); B32B 27/283 (2013.01); C08G 77/52 (2013.01); C08G 77/70 (2013.01); C09J 183/04 (2013.01); H01L 21/6835 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01); B05D 3/02 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A temporary bonding adhesive composition includes a first compound including a thermosetting polyorganosiloxane and a second compound including a thermoplastic polyorganosiloxane.