The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Oct. 20, 2015
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 183/06 (2006.01); B29C 65/00 (2006.01); B32B 27/08 (2006.01); B32B 27/26 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 37/24 (2006.01); B32B 37/00 (2006.01); H01L 21/78 (2006.01); H01L 23/29 (2006.01); C08G 77/52 (2006.01); C08K 3/36 (2006.01); C09D 183/14 (2006.01); C08G 77/14 (2006.01); C08G 77/48 (2006.01); C08G 77/50 (2006.01); C08L 63/00 (2006.01); C08L 83/14 (2006.01); B29L 31/34 (2006.01); B29K 683/00 (2006.01);
U.S. Cl.
CPC ...
C09D 183/06 (2013.01); B29C 66/45 (2013.01); B29C 66/71 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/26 (2013.01); B32B 27/283 (2013.01); B32B 37/025 (2013.01); B32B 37/24 (2013.01); C08G 77/14 (2013.01); C08G 77/48 (2013.01); C08G 77/50 (2013.01); C08G 77/52 (2013.01); C08K 3/36 (2013.01); C08L 63/00 (2013.01); C08L 83/14 (2013.01); C09D 183/14 (2013.01); H01L 21/78 (2013.01); H01L 23/296 (2013.01); B29K 2683/00 (2013.01); B29L 2031/34 (2013.01); B32B 2037/243 (2013.01); B32B 2383/00 (2013.01); B32B 2457/14 (2013.01);
Abstract
A silicone resin comprising constitutional units represented by formula (1) and having a Mw of 3,000-500,000 contains 10-50 wt % of (A-1) a first silicone resin having a silicone content of 10-40 wt % and (A-2) a second silicone resin having a silicone content of 50-80 wt %. A resin composition comprising the silicone resin can be formed in film form, and it possesses satisfactory covering or encapsulating performance to large size/thin wafers. The resin composition or resin film ensures satisfactory adhesion, low warpage, and wafer protection. The resin film is useful in wafer-level packages.