The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

Mar. 13, 2015
Applicant:

Rohm and Haas Electronic Materials Cmp Holdings, Inc., Newark, DE (US);

Inventors:

Joseph So, Wilmington, DE (US);

Bainian Qian, Newark, DE (US);

Janet Tesfai, Philadelphia, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/00 (2006.01); B24B 37/20 (2012.01); B24B 37/013 (2012.01); B24B 49/12 (2006.01); B24B 37/005 (2012.01);
U.S. Cl.
CPC ...
B24B 37/205 (2013.01); B24B 37/005 (2013.01); B24B 37/013 (2013.01); B24B 49/12 (2013.01);
Abstract

A chemical mechanical polishing pad is provided having a polishing layer; an endpoint detection window; subpad; and, a stack adhesive; wherein the subpad includes plurality of apertures in optical communication with the endpoint detection window; and, wherein the polishing surface of the polishing layer is adapted for polishing of a substrate.


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