The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Nov. 21, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Szu-Ying Chen, Toufen Township, TW;

Meng-Hsun Wan, Taipei, TW;

Tzu-Jui Wang, Fengshan, TW;

Dun-Nian Yaung, Taipei, TW;

Jen-Cheng Liu, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 25/00 (2006.01); H01L 27/146 (2006.01); H01L 21/768 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/76898 (2013.01); H01L 25/18 (2013.01); H01L 27/1464 (2013.01); H01L 27/14609 (2013.01); H01L 27/14634 (2013.01); H01L 27/14685 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A device includes a first chip including an image sensor therein, and a second chip bonded to the first chip. The second chip includes a logic device selected from the group consisting essentially of a reset transistor, a selector, a row selector, and combinations thereof therein. The logic device and the image sensor are electrically coupled to each other, and are parts of a same pixel unit.


Find Patent Forward Citations

Quick Actions:

Chen, Szu-Ying. (2016). Forming pixel units of image sensors through bonding two chips (U.S. Patent No. 9443836). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9443836

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